Qualcomm anounces Snapdragon 625 ,435 and 425 processors and 1 gigabit capable X16 LTE modem

Qualcomm has anounced three new Soc's for 2016 . The new Snapdragon 625 , 435 and 425 are three of the latest 64bit capable mid range processors from the manufacturer .Qualcomm also launched a new smartphone LTE modem -the X6 which has the capability to hit speeds of 1 gigabit -impressive considering that data will be transfered over the air .the three chips are said to be in some midrange 2016 smartphones while the x16 modem is said to be in 2017 flagship smartpones (most probably mated with the Snapdragon 830?) .

Snapdragon X16 Modem

This is Qualcomms next gen mobile modem , the component -designed with 2017 flagships in mind will boast a mindblowing gigabit wireless transfer speed ,for comparisson the Snapdragon 820's X12 modem only supports upto 600 m/bps

Features
-1000 mbps data data download speed
-14nm FinFet design
-Support for LTE -U
-4x4MiMO for faster data input and output
-available in 2017

Snapdragon 625

Features
-Octa core 2Ghz (Cortex A53) , 28nm design
-Adreno 505 Gpu
-support Hvec ,Avc (h.265,h.264) codecs
-support for 1080K and 21mp camera modules
-OpenGLES 3.1
-300mbps dl,150mbps ul speeds via X8 modem
-LTE support
-Quickcharge 3.0 support

Snapdragon 435

Features
-Octa core 1.4Ghz (Cortex A53) , 14nm FinFet design
-Adreno 506 Gpu
-support Hvec ,Avc (h.265,h.264) codecs
-support for 4K and 24mp camera modules
-OpenGLES 3.1
-300mbps dl,150mbps ul speeds via X8 modem
-LTE support
-Quickcharge 3.0 support
-pin compatible with previous S400/410 motherboards

Snapdragon 425

Features
-Quad core 1.4Ghz (Cortex A53) , 28nm design
-Adreno 308 Gpu
-support Hvec ,Avc (h.265,h.264) codecs
-support for 1080p and 16mp camera modules
-OpenGLES 3.0
-150mbps dl,75mbps ul speeds via X6 modem
-LTE support
-Quickcharge 3.0 support
-Pin compatible with previous S400/410 motherboards

Source - Qualcomm

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