Samsung has started to drop its all plastic image with the introduction of the new Note , Alpha and E series of metal banded smartphones and apparently they are doing a really good job for now , While Samsung was busy making new metal , their competition has also gone a step further and finally smartphones today are starting to look like well polished and capable handsets compared to their predecessors from a year back , that being said Samsung has not forgotten its flagship S series and that too is said to get a metal frame in the next iteration -the Galaxy S6 .According to a Bloomberg report , the next Samsung flagship is said to pack the latest heat in the smartphone game , but sadly that heat might also be a factor in what processor the phone might pack as Qualcomm's new Snapdragon 810's are said to have overheating problems . Samsung - a company that basically makes everything has its own in house Exynos Octa (4+$ Cortex A57 and A53 core) processors that might replace Qualcomm as the standard SoC in many markets until Qualcomm gets their stuff together (Snapdragon 815?) ..Samsung has already invested $15 billion in expanding their fabrication of Exynos processors so its highly likely that most Asian models will have the Exynos version even if they opt to use Qualcomm . The rest of the phone specs include 4GB of Ram , a QHD Amoled display and Android 5.0 out of the box . The Galaxy S6 smartphone is rumored for a 2nd of March launch date .
Written by Rakitha for MasHD
Source - AndroidAuthority
Bloomberg
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